Product Details
Place of Origin: China
Brand Name: Shiye
Certification: ISO9001:2015
Model Number: Custom
Payment & Shipping Terms
Minimum Order Quantity: 1
Price: According to the drawings
Packaging Details: Accept buyer's request for customized packaging
Delivery Time: 7-14 days
Payment Terms: L/C,D/A,D/P,T/T
Supply Ability: 10000Pcs/ Month
Application: |
Semiconductor Wafer Transfer, Wafer Prealignment And Inspection Equipment |
Material: |
PEEK Engineering Polymer, Grade Specified On Drawing |
Tolerance: |
±0.01mm |
Processing: |
CNC Milling, Contour Machining, Drilling |
Surface Treatment: |
Machined Finish, Edge Deburring, Cleaning As Specified |
Quality Control: |
Fork Tip Spacing Inspection, Flatness Measurement, Mounting Hole Verification, Dimensional Inspection |
Application: |
Semiconductor Wafer Transfer, Wafer Prealignment And Inspection Equipment |
Material: |
PEEK Engineering Polymer, Grade Specified On Drawing |
Tolerance: |
±0.01mm |
Processing: |
CNC Milling, Contour Machining, Drilling |
Surface Treatment: |
Machined Finish, Edge Deburring, Cleaning As Specified |
Quality Control: |
Fork Tip Spacing Inspection, Flatness Measurement, Mounting Hole Verification, Dimensional Inspection |
This custom CNC machined PEEK wafer transfer fork is designed for automated semiconductor handling systems that move silicon wafers between cassette load ports, prealignment stations and inspection equipment. The fork tines support designated wafer contact areas while the rear mounting interface connects to the equipment’s robotic handling mechanism.
PEEK offers a lightweight engineering polymer option with electrical insulation and good machinability. The exact PEEK grade should be selected according to the required chemical compatibility, operating temperature, static control and wafer contact requirements.
Before production, confirm the wafer diameter, support point locations, fork tip spacing, mounting hole pattern, flatness and required clearance to nearby equipment. For cleanroom applications, the polymer grade, cleaning process and acceptable particle contamination requirements should also be defined before release.
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