CNC PEEK IC Test Socket Package Guide Insert for BGA Testing

This custom CNC machined PEEK guide insert is designed for IC test sockets used to position BGA or QFN packages during electrical testing and validation. The package cavity guides the device into position, while the mounting features locate the insert within the socket assembly before electrical contact is made.
PEEK provides a lightweight engineering polymer option with good machinability and dimensional stability. If electrostatic control or specific cleanroom cleanliness is required, the material grade and cleaning requirements must be explicitly specified.
Before production, confirm the package outline, cavity clearance, contact area keep out zones, mounting interface, flatness and replacement requirements. The guide insert must match the socket geometry so that the device seats correctly without interfering with contacts or package edges.

For more custom semiconductor test socket components, explore our IC Test Sockets

For precision cavities and multi face component machining, see our  CNC Multi-Axis Machining.

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